Semiconductor package

A semiconductor package comprising:

• a first connection structure having a first surface and a second surface opposing the first surface and including one or more first redistribution layers;
• a first semiconductor chip disposed on the first surface of the first connection structure, a surface of the first semiconductor chip, on which a first connection pad of the first semiconductor chip is disposed, facing the first surface of the first connection structure;
• a second semiconductor chip disposed on the second surface of the first connection structure, a surface of the second semiconductor chip, on which a second connection pad of the second semiconductor chip is disposed, facing the second surface of the first connection structure;
• a third semiconductor chip disposed on the second surface of the first connection structure, a surface of the third semiconductor chip, on which a third connection pad of the third semiconductor chip is disposed, facing the second surface of the first connection structure;
• and
• a first passive component disposed between the second and third semiconductor chips on the second surface of the first connection structure,
• wherein the first connection structure includes a first region including a region overlapping, in a thickness direction of the semiconductor package, the first passive component, and second regions including regions respectively overlapping, in the thickness direction of the semiconductor package, at least portions of the second and third semiconductor chips,
• the first region is disposed between the second regions, and
• the one or more first redistribution layers include at least one of a power pattern and a ground pattern in the first region and includes a signal pattern in the second region.