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US 2020/0266173 A1Published application
Methods for fabricating 3d semiconductor device packages, resulting packages and systems incorporating such packages
AssigneeMicron Technology, Inc.
InventorEiichi Nakano
Life of this patent
Estimating the term…
Abstract
Methods of forming semiconductor device packages comprising stacking multiple dice, the die stack exhibiting thin bond lines and having an outer environmental coating, the bond lines and environmental coating comprising an in situ formed compound. Semiconductor device packages so formed and electronic systems incorporating such packages are also disclosed.
Claims22
A semiconductor device package, comprising:
- a stack of semiconductor dice;
- non-polymeric dielectric bonds between adjacent semiconductor dice of the stack;
- connections between metal pillars and aligned terminal pads of adjacent semiconductor dice of the stack, the connections comprising at least one of diffusion bonds or mutual contact secured by the dielectric bonds;
- and
- a non-polymeric coating extending over a back side of an uppermost semiconductor die of the stack, over and in contact with sides of the semiconductor dice of the stack.
2 more elements
A semiconductor device package, comprising:
- stacked semiconductor dice;
- a non-polymeric dielectric material devoid of filler material bonding adjacent semiconductor dice;
- electrical connections extending through the non-polymeric dielectric material between adjacent semiconductor dice;
- and
- a non-polymeric coating extending at least over sides of the semiconductor dice.
2 more elements
Dependencies are inferred from the claim text.