Resin composition, conductive copper paste, and semiconductor device
AssigneeNamics Corporation
InventorTomoyuki TAKAHASHI
Life of this patent
Estimating the term…
Abstract
An object of the present invention is to provide: a resin composition in which the specific resistance after curing is low regardless of the type of a thermosetting resin, and furthermore, the specific resistance after curing does not significantly change depending on the content of a copper powder; and a conductive copper paste including the resin composition. There are provided a resin composition including (A) a copper powder having an oxygen content of 0.3% by mass or less, (B) a thermosetting resin, (C) a fatty acid, and (D) an amine or an amine compound, as well as a conductive copper paste containing the resin composition. The (A) component has an average particle size of preferably 1 to 10 μm.
Claims8
A resin composition, comprising:
- (A) a copper powder having an oxygen content of 0.3% by mass or less;
- (B) a thermosetting resin;
- (C) a fatty acid;
- and
- (D) an amine or an amine compound.
Dependencies are inferred from the claim text.