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US 2020/0266166 A1Published application
Semiconductor device
AssigneeIntel Deutschland GmbH
InventorsChristoph Kutter, Ewald Soutschek, Georg Meyer-Berg
Life of this patent
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Abstract
A semiconductor device including a semiconductor chip having a first conduction element; a substrate having second and third conduction elements; and external connection elements configured to form an electrical path between the second and third conduction elements via the first conduction element.
Claims11
(canceled)
A semiconductor device, comprising:
- a semiconductor chip having a face comprising a plurality of contact elements, and the semiconductor chip having a backside opposite the face;
- a mold mass on the backside of the semiconductor chip and along sides of the semiconductor chip;
- a first dielectric layer having a first side opposite a second side, the first side of the first dielectric layer on the face of the chip and on the mold mass;
- a plurality of contacts within the first dielectric layer;
- a metallization layer on the second side of the first dielectric layer, the metallization layer comprising a plurality of conducting elements, the plurality of conducting elements coupled directly to the plurality of contact elements of the face of the semiconductor chip by the plurality of contacts, wherein a first one and a second one of the plurality of conducting elements of the metallization layer are electrically coupled to one another by one of the plurality of contact elements of the face of the semiconductor chip, and wherein a third one of the of the plurality of conducting elements of the metallization layer is between the first one and the second one of the plurality of conducting elements of the metallization layer;
- a second dielectric layer on the metallization layer;
- and
- a plurality of vias in the second dielectric layer, the plurality of vias directly coupled to the plurality of conducting elements of the metallization layer, wherein the plurality of vias is both within and outside of the footprint of the chip.
5 more elements
A system, comprising:
- a board;
- a semiconductor device coupled to the board, the semiconductor device comprising:
- a semiconductor chip having a face comprising a plurality of contact elements, and the semiconductor chip having a backside opposite the face;
- a mold mass on the backside of the semiconductor chip and along sides of the semiconductor chip;
- a first dielectric layer having a first side opposite a second side, the first side of the first dielectric layer on the face of the chip and on the mold mass;
- a plurality of contacts within the first dielectric layer;
- a metallization layer on the second side of the first dielectric layer, the metallization layer comprising a plurality of conducting elements, the plurality of conducting elements coupled directly to the plurality of contact elements of the face of the semiconductor chip by the plurality of contacts, wherein a first one and a second one of the plurality of conducting elements of the metallization layer are electrically coupled to one another by one of the plurality of contact elements of the face of the semiconductor chip, and wherein a third one of the of the plurality of conducting elements of the metallization layer is between the first one and the second one of the plurality of conducting elements of the metallization layer;
- a second dielectric layer on the metallization layer;
- and
- a plurality of vias in the second dielectric layer, the plurality of vias directly coupled to the plurality of conducting elements of the metallization layer, wherein the plurality of vias is both within and outside of the footprint of the chip.
7 more elements
Dependencies are inferred from the claim text.