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US 2020/0266159 A9Published application
Method of making a stacked inductor-electronic package
AssigneeIntersil Americas Inc.
InventorsZAKI MOUSSAOUI, Nikhil Vishwanath Kelkar
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Abstract
An embodiment of a circuit includes a circuit module and an inductor disposed over and electrically coupled to the module. Disposing the inductor over the module may reduce the area occupied by the circuit as compared to a circuit where the inductor is disposed adjacent to the module, or to a circuit where the inductor is disposed in the module adjacent to other components of the module. Furthermore, disposing the inductor outside of the module may allow one to install or replace the inductor.
Claims11
A method, comprising:
- fabricating a batch of inductors connected to each other;
- fabricating a batch of modules;
- attaching the batch of inductors to the batch of modules;
- and
- separating the inductors from each other to create a plurality of assemblies, each assembly including an inductor stacked on top of a module.
2 more elements
A method, comprising:
- placing a first inductor over a power-supply module;
- and
- electrically coupling the first inductor to the module.
Dependencies are inferred from the claim text.