Package structure with structure reinforcing element and manufacturing method thereof

A package structure, comprising:

• a redistribution structure comprising a first circuit layer and a second circuit layer disposed over the first circuit layer, wherein the first circuit layer is electrically connected to the second circuit layer;
• a chip disposed over the redistribution structure and electrically connected to the second circuit layer;
• an inner conductive reinforcing element disposed over the redistribution structure, wherein the inner conductive reinforcing element comprises:
• a reinforcing layer having a Young's modulus in a range of 30 to 200 GPa, wherein the reinforcing layer has a through hole;
• and
• a conductive connector disposed in the through hole, wherein a top portion of the conductive connector and a bottom portion thereof are exposed outside the reinforcing layer, and the bottom portion of the conductive connector is electrically connected to the second circuit layer;
• a protective layer overlying the chip and a sidewall of the inner conductive reinforcing element;
• and
• an antenna pattern disposed over the protective layer and electrically connected to the top portion of the conductive connector.

A method of manufacturing a package structure, comprising:

• (i) providing a redistribution structure, wherein the redistribution structure comprises a first circuit layer and a second circuit layer disposed over the first circuit layer, and the first circuit layer is electrically connected to the second circuit layer;
• (ii) forming an inner conductive reinforcing element over the redistribution structure, wherein the inner conductive reinforcing element comprises:
• a reinforcing layer having a Young's modulus in a range of 30 to 200 GPa, wherein the reinforcing layer has a through hole;
• and
• a conductive connector disposed in the through hole, wherein a top portion of the conductive connector and a bottom portion thereof are exposed outside the reinforcing layer, and the bottom portion of the conductive connector is electrically connected to the second circuit layer;
• (iii) disposing a chip over the redistribution structure, wherein the chip is electrically connected to the second circuit layer;
• (iv) forming a first protective layer overlying the chip and the inner conductive reinforcing element;
• and
• (v) disposing an electronic component over the first protective layer, wherein the electronic component is electrically connected to the top portion of the conductive connector.

A method of manufacturing a package structure, comprising:

• (i) providing a redistribution structure, wherein the redistribution structure comprises a first circuit layer and a second circuit layer disposed over the first circuit layer, and the first circuit layer is electrically connected to the second circuit layer;
• (ii) forming an inner conductive reinforcing element over the redistribution structure, wherein the inner conductive reinforcing element comprises:
• a reinforcing layer having a Young's modulus in a range of 30 to 200 GPa, wherein the reinforcing layer has a through hole;
• and
• a conductive connector disposed in the through hole, wherein a top portion of the conductive connector and a bottom portion thereof are exposed outside the reinforcing layer, and the bottom portion of the conductive connector is electrically connected to the second circuit layer;
• (iii) disposing a chip over the redistribution structure, wherein the chip is electrically connected to the second circuit layer;
• (iv) forming a protective layer overlying the chip and the inner conductive reinforcing element;
• and
• (v) forming an antenna pattern over the protective layer, wherein the antenna pattern is electrically connected to the top portion of the conductive connector.