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US 2020/0266154 A1Published application
Semiconductor device
AssigneeAblic Inc.
InventorsSatoshi SUZUKI, Yoshitaka KIMURA
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Abstract
A semiconductor device includes a lead frame having a die pad; a semiconductor chip having a front surface in which an integrated circuit is formed, and a back surface that is die-bonded onto the die pad through intermediation of an interposing film and an adhesive layer; and an encapsulating resin for encapsulating the lead frame, the adhesive layer, the interposing film, and the semiconductor chip. The interposing film has a first opening which forms a space between a part of the back surface of the semiconductor chip and the adhesive layer.
Claims14
A semiconductor device, comprising:
- a lead frame having a die pad;
- a semiconductor chip having a front surface in which an integrated circuit is formed, and a back surface that is die-bonded onto the die pad through intermediation of an interposing film and an adhesive layer;
- and
- an encapsulating resin for encapsulating the lead frame, the adhesive layer, the interposing film, and the semiconductor chip,
- wherein the interposing film has a first opening which forms a space between a part of the back surface of the semiconductor chip and the adhesive layer.
2 more elements
Dependencies are inferred from the claim text.