Method and device for the integration of semiconductor wafers
AssigneeLpkf Laser & Electronics AG
InventorsRoman OSTHOLT, Norbert AMBROSIUS
Life of this patent
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Abstract
A method for the integration of semiconductor components in a confined space, in particular for 3D integration, in which, after positioning relative to a carrier substrate and/or a redistribution layer, the semiconductor components are protected and fixed in their relative position by introduction of a potting compound, characterized in that before the introduction of the potting compound, a glass substrate having a multiplicity of cutouts separated by partition walls and serving to receive a semiconductor component, is positioned in such a way that the semiconductor component is enclosed by the sidewall surfaces—facing it—of the respective partition walls of the glass substrate.
Claims30
1-23. (canceled)
A method for the integration of semiconductor wafers in a confined space for 3D integration, in which, after positioning relative to at least one of the group comprising a carrier substrate and a redistribution layer (RDL), the semiconductor wafer(s) is/are protected and fixed in its/their relative position by introduction of a potting compound, wherein before the introduction of the potting compound, a glass substrate having a multiplicity of cutouts separated by partition walls and serving to receive in each case at least one semiconductor wafer is positioned in such a way that the at least one semiconductor wafer is enclosed by the sidewall surfaces—facing it—of the respective partition walls of the glass substrate.
A method for the integration of semiconductor wafers in a confined space, for 3D integration for producing a fan-out package, as claimed in any of the preceding claims, comprising the following method steps:
- providing a carrier substrate having at least one semiconductor wafer secured thereon by way of an adhesive layer,
- providing a glass substrate having at least one cutout,
- positioning the glass substrate on the adhesive layer of the carrier substrate in such a way that the at least one semiconductor wafer is arranged in the at least one cutout,
- embedding the at least one semiconductor wafer in the at least one cutout by means of a potting compound, and
- removing carrier substrate and adhesive film from the remaining package comprising semiconductor wafer, glass substrate and potting compound.
Dependencies are inferred from the claim text.