Electronic package structure
AssigneeMerry Electronics(Shenzhen) Co., Ltd.
InventorsJen-Yi CHEN, Chao-Sen CHANG, Shen-Hang WEI
Life of this patent
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Abstract
An electronic package structure includes a first printed circuit board, a second printed circuit board and first space columns. The first printed circuit board has a first surface and a through hole. The second printed circuit board has a second surface facing the first surface. Each first space column is interconnected between the first surface and the second surface. An encapsulation layer is filled between the first and second printed circuit boards and among the first space columns so as to define a hollow chamber. A MEMS microphone component located within the hollow chamber is located on the first surface and aligned with the through hole. A sensing component is located within the hollow chamber.
Claims13
An electronic package structure comprising:
- a first printed circuit board having a first surface and a through hole;
- a second printed circuit board having a second surface facing the first surface;
- a plurality of first space columns, each first space column is interconnected between the first surface and the second surface;
- an encapsulation layer filled between the first and second printed circuit boards and among the first space columns so as to define a hollow chamber;
- a Micro-Electro-Mechanical System (MEMS) microphone component disposed within the hollow chamber and located on the first surface and aligned with the through hole;
- and
- a sensing component located within the hollow chamber.
Dependencies are inferred from the claim text.