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US 2020/0266145 A1Published application
Additively manufactured programmable resistive jumpers
AssigneeTexas Instruments Incorporated
InventorsPaul Merle Emerson, Benjamin Stassen Cook
Life of this patent
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Abstract
A first conductive routing structure is electrically connected to a first electronic component. A second conductive routing structure is electrically connected to a second electronic component. An additive deposition process deposits a material over a surface of a processed wafer to form a conductive or resistive structure, which extends from a portion of the first conductive routing structure to a portion of the second conductive routing structure, to configure a circuit including the first and second electronic components.
Claims5
An integrated circuit, comprising:
- a semiconductor substrate;
- electronic components on or in the semiconductor substrate;
- a metallization structure, including:
- a first conductive routing structure electrically connected to a first one of the electronic components;
- a second conductive routing structure that is electrically connected to a second one of the electronic components;
- and a dielectric layer;
- and
- an additively deposited material disposed over the dielectric layer, the material extending from a portion of the first conductive routing structure to a portion of the second conductive routing structure.
5 more elements
Dependencies are inferred from the claim text.