Electronic device, method of manufacturing electronic device, and lead
AssigneeSeiko Epson Corporation
InventorHisao MOTOYAMA
Life of this patent
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Abstract
The electronic device includes an electronic component, a plurality of leads electrically coupled to the electronic component, and a mold cover covering the electronic component, wherein the plurality of leads includes an inner part located inside the mold cover, and an outer part located outside the mold cover, and the inner part includes a first lead electrically coupled to the electronic component, a second lead separated from the first lead and integrated with the outer part, and a coupling member configured to electrically couple the first lead and the second lead to each other.
Claims18
An electronic device comprising:
- an electronic component;
- a plurality of leads electrically coupled to the electronic component;
- and
- a mold cover covering the electronic component, wherein
- the plurality of leads includes
- an inner part located inside the mold cover, and
- an outer part located outside the mold cover, and
- the inner part includes
- a first lead electrically coupled to the electronic component,
- a second lead separated from the first lead and integrated with the outer part, and
- a coupling member configured to electrically couple the first lead and the second lead to each other.
A method of manufacturing an electronic device comprising:
- preparing a plurality of leads including a first lead, a second lead separated from the first lead, and a coupling member configured to electrically couple the first lead and the second lead to each other;
- electrically coupling the electronic component to the first lead of the plurality of leads;
- and
- molding the electronic component, the first lead, the coupling member, and the second lead with a resin material.
A lead frame comprising:
- a plurality of leads including
- a first lead to be electrically coupled to an electronic component,
- a second lead separated from the first lead, and
- a coupling member configured to electrically couple the first lead and the second lead to each other.
Dependencies are inferred from the claim text.