Semiconductor package with leadframe having pre-singulated leads or lead terminals
AssigneeTexas Instruments Incorporated
InventorsBradley Andrew Glasscock, Michael Todd Wyant, Christopher Daniel Manack
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Abstract
A packaged semiconductor device includes at least one semiconductor die having circuitry with circuit nodes coupled to bond pads that have bonding features thereon. A plurality of leads or lead terminals include at least metal bars, wherein the plurality of leads or lead terminals are exclusive of any saw marks. The semiconductor die is flipchip attached with a bonded connection between respective bonding features and respective leads or lead terminals.
Claims25
A packaged semiconductor device, comprising:
- at least one semiconductor die having circuitry with circuit nodes coupled to bond pads with bonding features thereon, and
- a plurality of leads or lead terminals comprising at least metal bars, wherein the plurality of leads or lead terminals are exclusive of any saw marks;
- wherein the semiconductor die is flipchip attached with a bonded connection between respective ones of the bonding features and respective ones of the plurality of leads or lead terminals.
A packaged semiconductor device, comprising:
- at least one semiconductor die having circuitry with circuit nodes coupled to bond pads with solder features thereon;
- a plurality of leads or lead terminals comprising metal bars and at least one passive device having a top side bondable terminal, wherein the plurality of leads or lead terminals are exclusive of any saw marks;
- wherein the semiconductor die is flipchip attached with a bond between respective ones of the solder features and respective ones of the plurality of leads or lead terminals.
10-19. (canceled)
A packaged semiconductor device, comprising:
- a plurality of pre-singulated leads or lead terminals comprising at least metal bars on a substrate that holds the metal bars in position on the substrate;
- at least one semiconductor die having circuitry with circuit nodes coupled to bond pads with bonding features thereon;
- and
- the semiconductor die bonding features are bonded to the plurality of pre-singulated leads or lead terminals.
A packaged semiconductor device, comprising:
- a plurality of pre-singulated leads or lead terminals comprising at least one metal bar;
- at least one semiconductor die having circuitry with circuit nodes coupled to bond pads with bonding features thereon;
- the semiconductor die bonding features are bonded to the plurality of pre-singulated leads or lead terminals;
- and
- mold material covering the at least one semiconductor die, bonding features and at least a portion of the plurality of pre-singulated leads or lead terminals.
Dependencies are inferred from the claim text.