Electronic Module with Improved Heat Dissipation and Fabrication Thereof
AssigneeInfineon Technologies Austria AG
InventorsEdward Fuergut, Dae Kuen Park
Life of this patent
Estimating the term…
Abstract
An electronic module includes a semiconductor package having a die pad, a semiconductor die, and an encapsulant. The encapsulant has a first main face and a second main face opposite to the first main face. The die pad has a first main face and a second main face opposite to the first main face. The semiconductor die is disposed on the second main face of the die pad. An insulation layer is disposed on at least a portion of the first main face of the encapsulant and on the first main face of the die pad. The insulation layer is electrically insulating and thermally conducting. A heatsink is disposed on or in the insulation layer.
Claims19
An electronic module, comprising:
- a semiconductor package comprising a die pad, a semiconductor die, and an encapsulant, the encapsulant comprising a first main face and a second main face opposite to the first main face, the die pad comprising a first main face and a second main face opposite to the first main face, the semiconductor die being disposed on the second main face of the die pad;
- an insulation layer on at least a portion of the first main face of the encapsulant and on the first main face of the die pad, the insulation layer being electrically insulating and thermally conducting;
- and
- a heatsink on or in the insulation layer,
- wherein a main face of the heatsink (3) is exposed to the outside.
An electronic device, comprising:
- a semiconductor package comprising a die pad, a semiconductor die, and an encapsulant, the encapsulant comprising a first main face and a second main face opposite to the first main face, the die pad comprising a first main face and a second main face opposite to the first main face, the semiconductor die being disposed on the second main face of the die pad;
- an insulation layer on the first main face of the encapsulant and on the first main face of the die pad, the insulation layer being electrically insulating and thermally conducting;
- a first heatsink on or in the insulation layer;
- and
- a second heatsink on the insulation layer and the first heatsink.
A method for fabricating an electronic module, the method comprising:
- providing a semiconductor package comprising a die pad, a semiconductor die, and an encapsulant, the encapsulant comprising a first main face and a second main face opposite to the first main face, the die pad comprising a first main face and a second main face opposite to the first main face, the semiconductor being disposed on the second main face of the die pad;
- and
- applying an insulation layer and a heatsink onto the first main face of the encapsulant and on the first main face of the die pad so that the heatsink is disposed on or in the insulation layer, the insulation layer being electrically insulating and thermally conducting.
Dependencies are inferred from the claim text.