Heating and cooling apparatus having moisture removal function for testing electrical characteristic of semiconductor element using probe system
OwnerYang Yoon Seoninventor
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Abstract
The present disclosure relates to a heating and cooling apparatus having a moisture removal function for testing electrical characteristics of a semiconductor element using a probe system, in which the heating and cooling apparatus is configured to be capable of hot and cold measurement of a wafer or a flat panel display product and to be capable of efficiently removing water droplets generated at the time of cooling by adding a vortex tube to a thermo-stream provided in a probe head of the probe system and configuring the vortex tube to be interlocked with a moisture removal device.
Claims4
A heating and cooling apparatus having a moisture removal function for testing electrical characteristics of a semiconductor element using a probe system, the apparatus comprising:
- a cooling chiller configured to primarily cool and discharge compressed air which is supplied from an outside and has normal temperature;
- a flow rate controller installed in an air supply pipe to which the air from the cooling chiller is discharged and configured to adjust a flow rate and a hydraulic pressure of the compressed air;
- a compressed air cooler configured to separately spray the compressed air, which has been adjusted in the flow rate controller, into cold air and hot air after the compressed air has flowed thereinto;
- a first heater configured to heat cold air from a port at one side of the compressed air cooler to a predetermined temperature so as to adjust the temperature to an accurate temperature required for testing the electrical characteristics;
- an air nozzle configured to spray the air heated through the first heater to a measurement position for the electrical characteristic test;
- a second heater configured to a hot air from another port of the compressed air cooler to a high temperature required for dehumidification;
- and
- a dehumidifying nozzle configured to spray the air heated by the second heater around air sprayed from the air nozzle.
Dependencies are inferred from the claim text.