Label including an electronic chip for a barrel and associated production method
AssigneeWid Group
InventorsAlexandre MONGRENIER, Benoît SUDRE
Life of this patent
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Abstract
A label is applied to a barrel containing liquid. The label includes an electronic chip, which includes a first layer as a support layer, a second layer as an electronic chip layer, and a third layer as a customization layer. The electronic chip layer includes at least an electronic chip and an antenna connected to the electronic chip. The customization layer includes at least one metal sublayer made of a metal material. Each of the layers has two faces, and the three layers are placed one above the other in a stacking direction. The thickness of the metal sublayer along the stacking direction is less than or equal to 35 μm.
Claims12
A barrel containing liquid, said barrel having applied thereto a label comprising an electronic chip, the label including:
- a first layer, called support layer comprising two faces,
- a second layer, called electronic chip layer, comprising at least an electronic chip and an antenna connected to the electronic chip, the electronic chip layer including a first face in contact with the support layer and a second face opposite the first face, and
- a third layer, called customization layer, having a first face in contact with the second face of the electronic chip layer and a second face opposite the first face of the customization layer,
- wherein the three layers are superimposed in a stacking direction,
- and wherein the customization layer comprises at least one sublayer, called metal sublayer, made from a metal material, the metal sublayer having a thickness along the stacking direction being less than or equal to 35 micrometers.
A method of labeling a barrel containing liquid, comprising applying to the barrel a label comprising an electronic chip, the label including:
- a first layer, called support layer comprising two faces,
- a second layer, called electronic chip layer, comprising at least an electronic chip and an antenna connected to the electronic chip, the electronic chip layer including a first face in contact with the support layer and a second face opposite the first face, and
- a third layer, called customization layer, having a first face in contact with the second face of the electronic chip layer and a second face opposite the first face of the customization layer,
- wherein the three layers are superimposed in a stacking direction,
- and wherein the customization layer comprises at least one sublayer, called metal sublayer, made from a metal material, the metal sublayer having a thickness along the stacking direction being less than or equal to 35 micrometers.
Dependencies are inferred from the claim text.