Socket interconnector with compressible ball contacts for high pad count memory cards
AssigneeWestern Digital Technologies, Inc.
InventorsJohn Burke, Yoseph Pinto
Life of this patent
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Abstract
A memory card socket interconnector is disclosed including a pair of cavities configured to receive a pair of memory cards. The cavities include patterns of memory card interconnect pads. A second surface of the socket interconnector includes socket interconnect pads, distributed across the second surface of the socket interconnector, which are electrically coupled to the memory card interconnect pads. The memory card socket interconnector may further include electrically conductive balls provided between the memory card pads and the memory card interconnect pads in each cavity to enable good electrical contact between the memory card pads and the memory card interconnect pads.
Claims21
A memory card socket interconnector configured to support one or more memory cards in a socket of a host device, the memory card socket interconnector comprising:
- a set of memory card interconnect pads on a first surface of the memory card socket interconnector, the set of memory card interconnect pads configured to mate with pads on the one or more memory cards;
- an electrically conductive epoxy layer adhered to discrete ones of the interconnect pads, the electrically conductive epoxy layer facilitating electrical contact between the set of memory card interconnect pads and the pads on the one or more memory cards;
- a set of socket interconnect pads on a second surface of the memory card socket interconnector opposite the first surface, the set of socket interconnect pads configured to mate with pins within the socket of the host device, wherein a center-to-center distance of the set of socket interconnect pads are greater than a center-to-center distance of at least some of the set of memory card interconnect pads on the first surface;
- and
- a redistribution layer between the first and second surfaces electrically redistributing the set of memory card interconnect pads to the set of socket interconnect pads.
A memory card socket interconnector configured to support one or more memory cards in a socket of a host device, the memory card socket interconnector comprising:
- a set of memory card interconnect pads on a first surface of the memory card socket interconnector, the set of memory card interconnect pads having a pattern mirroring a pattern of pads on the one or more memory cards;
- electrically conductive balls formed on the set of memory card interconnect pads on the first surface of the memory card socket interconnector, the electrically conductive balls facilitating electrical contact between the set of memory card interconnect pads on the first surface of the memory card socket interconnector and the pads on the one or more memory cards;
- a set of socket interconnect pads on a second surface of the memory card socket interconnector opposite the first surface, the set of socket interconnect pads configured to mate with pins within the socket of the host device, wherein a center-to-center distance of the set of socket interconnect pads are greater than a center-to-center distance of at least some of the set of memory card interconnect pads on the first surface;
- and
- a redistribution layer between the first and second surfaces electrically redistributing the set of memory card interconnect pads to the set of socket interconnect pads.
-16. (canceled)
A memory card socket interconnector configured to support one or more memory cards in a socket of a host device, the memory card socket interconnector comprising:
- a set of memory card interconnect pads on a first surface of the memory card socket interconnector, the set of memory card interconnect pads configured to mate with pads on the one or more memory cards;
- first means, provided on surfaces of the set of memory card interconnect pads, for facilitating electrical contact between the set of memory card interconnect pads and the pads on the one or more memory cards;
- a set of socket interconnect pads on a second surface of the memory card socket interconnector opposite the first surface, the set of socket interconnect pads configured to mate with pins within the socket of the host device, wherein a center-to-center distance of the set of socket interconnect pads is greater than a center-to-center distance of at least some of the set of memory card interconnect pads on the first surface;
- and
- second means, between the first and second surfaces, for electrically redistributing the set of memory card interconnect pads to the set of socket interconnect pads.
Dependencies are inferred from the claim text.