Socket interconnector for high pad count memory cards
AssigneeWestern Digital Technologies, Inc.
InventorsJohn Burke, Hideo Nagasawa
Life of this patent
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Abstract
A memory card socket interconnector is disclosed including a pair of cavities configured to receive a pair of memory cards. The cavities include patterns of memory card interconnect pads. A second surface of the socket interconnector includes socket interconnect pads, distributed across the second surface of the socket interconnector, which are electrically coupled to the memory card interconnect pads. The memory card socket interconnector may further include an anisotropic elastomeric sheet provided between the memory card pads and the memory card interconnect pads in each cavity to enable good electrical contact between the memory card pads and the memory card interconnect pads.
Claims21
A memory card socket interconnector configured to support one or more memory cards in a socket of a host device, the memory card socket interconnector comprising:
- a set of memory card interconnect pads on a first surface of the memory card socket interconnector, the set of memory card interconnect pads configured to mate with pads on the one or more memory cards;
- a set of socket interconnect pads on a second surface of the memory card socket interconnector opposite the first surface, the set of socket interconnect pads configured to mate with pins within the socket of the host device, wherein the set of socket interconnect pads are spaced from each other by a greater amount than at least some of the set of memory card interconnect pads on the first surface;
- and
- a redistribution layer between the first and second surfaces electrically redistributing the set of memory card interconnect pads to the set of socket interconnect pads.
A memory card socket interconnector configured to support one or more memory cards in a socket of a host device, the memory card socket interconnector comprising:
- a set of memory card interconnect pads on a first surface of the memory card socket interconnector, the set of memory card interconnect pads having a pattern mirroring a pattern of pads on the one or more memory cards;
- an electrical conductor configured to be positioned between the set of memory card interconnect pads on the first surface of the memory card socket interconnector and the pads on the one or more memory cards to facilitate good physical and electrical contact between the set of memory card interconnect pads on the first surface of the memory card socket interconnector and the pads on the one or more memory cards;
- a set of socket interconnect pads on a second surface of the memory card socket interconnector opposite the first surface, the set of socket interconnect pads configured to mate with pins within the socket of the host device, wherein the set of socket interconnect pads are spaced from each other by a greater amount than at least some of the set of memory card interconnect pads on the first surface;
- and
- a redistribution layer between the first and second surfaces electrically redistributing the set of memory card interconnect pads to the set of socket interconnect pads.
A memory card socket interconnector configured to support a pair of memory cards in a socket of a host device, the memory card socket interconnector comprising:
- a first cavity formed in a first surface of the memory card socket interconnector, the first cavity comprising a first set of memory card interconnect pads, the first set of memory card interconnect pads configured to mate with pads of a first memory card having a PCIe interface positioned within the first cavity;
- a second cavity in the first surface of the memory card socket interconnector, the second cavity comprising a second set of memory card interconnect pads, the second set of memory card interconnect pads configured to mate with pads of a second memory card positioned within the second cavity;
- a set of socket interconnect pads on a second surface of the memory card socket interconnector opposite the first surface, the set of socket interconnect pads configured to mate with pins within the socket of the host device;
- and
- a redistribution layer between the first and second surfaces electrically redistributing the first and second sets of memory card interconnect pads to the set of socket interconnect pads.
Dependencies are inferred from the claim text.