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US 2020/0264391 A1Published application
Edge coupling through unetched surface of photonic chip
AssigneeCisco Technology, Inc.
InventorRavi S. Tummidi
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Abstract
Aspects disclosed herein include providing a photonic chip that includes an unetched side surface formed by a dicing process performed on a semiconductor wafer, and a first edge coupler that is optically exposed at the unetched side surface. The photonic chip is optically aligned with an external light-carrying medium. The first edge coupler is optically coupled with the external light-carrying medium through the unetched side surface.
Claims20
A method comprising:
- providing a photonic chip comprising:
- an unetched side surface formed by a dicing process performed on a semiconductor wafer, and a first edge coupler that is optically exposed at the unetched side surface;
- and
- optically aligning the photonic chip with an external light-carrying medium, wherein the first edge coupler is optically coupled with the external light-carrying medium through the unetched side surface.
1 more element
An optical apparatus comprising:
- a photonic chip comprising:
- an unetched side surface formed by a dicing process performed on a semiconductor wafer;
- and
- a first edge coupler that is optically exposed at the unetched side surface;
- and
- an external light-carrying medium in a fixed arrangement with the photonic chip,
- wherein the first edge coupler is optically coupled with the external light-carrying medium through the unetched side surface.
4 more elements
A method comprising:
- performing a dicing process on a semiconductor wafer to produce a plurality of photonic chips, wherein each photonic chip of the plurality of photonic chips comprises a respective edge coupler that is optically exposed at a respective unetched side surface formed by the dicing process;
- and
- optically aligning a first photonic chip of the plurality of photonic chips with an external light-carrying medium, wherein a first edge coupler of the first photonic chip is optically coupled with the external light-carrying medium through the respective unetched side surface.
Dependencies are inferred from the claim text.