Inspection method and apparatus
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChung-Pin CHOU, Yu-Liang TSENG
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Abstract
A method includes generating a primary radiation beam from a radiation source; splitting the primary beam into a first radiation beam and a second radiation beam; directing the first radiation beam onto a front side of a wafer; directing the second radiation beam onto a back side of a wafer; generating an image of the front side of the wafer by receiving a reflection of the first radiation beam reflected from the wafer; and generating an image of the back side of the wafer by receiving a reflection of the second radiation beam reflected from the wafer.
Claims21
A method, comprising:
- generating a primary radiation beam from a radiation source;
- splitting the primary radiation beam into a first radiation beam and a second radiation beam;
- directing the first radiation beam onto a front side of a wafer;
- directing the second radiation beam onto a back side of the wafer;
- generating an image of the front side of the wafer by receiving a reflection of the first radiation beam reflected from the wafer;
- and
- generating an image of the back side of the wafer by receiving a reflection of the second radiation beam reflected from the wafer.
A method, comprising:
- transferring a wafer into an inspection apparatus;
- generating a first image of a front side of the wafer;
- generating a second image of a back side of the wafer, wherein generating the first and second images are performed simultaneously;
- generating a third image of an edge of the wafer;
- and
- unloading the wafer from the inspection apparatus.
An apparatus, comprising:
- a plurality of wafer supporters defining a wafer occupiable zone thereon;
- a radiation source aimed at the wafer occupiable zone;
- a beam splitter between the radiation source and the wafer occupiable zone;
- a first reflector assembly optically coupling the beam splitter to a front side of the wafer occupiable zone;
- a second reflector assembly optically coupling the beam splitter to a back side of the wafer occupiable zone;
- a first optical detector optically coupled to the front side of the wafer occupiable zone;
- a second optical detector optically coupled to the back side of the wafer occupiable zone;
- and
- an edge inspection device having a center of curvature substantially level with the beam splitter.
(canceled)
Dependencies are inferred from the claim text.