Low work function materials

(canceled)

A reduced work function material comprising:

• a. a film having a first surface contacting a substrate and a second surface opposite said first surface, said film comprising a single crystal metal, an amorphous metal, or an electride and having a thickness of about 500 nm or less;
• and
• b. at least one patterned area on a film-contacting surface of said substrate with a periodic or a non-periodic pattern, wherein said second surface of said film comprises a flat smooth surface having a surface roughness less than about 1.0 nm.

A method for reducing work function in a material to a low or ultra-low work function level useful in nanoscale devices and processes, comprising:

• a. forming a film having a thickness of about 500 nm or less comprising a single crystal metal, an amorphous metal, or an electride with a first surface of said film in contact with a substrate and a second flat smooth surface having a surface roughness less than about 1.0 nm opposite said first surface;
• and
• b. forming a pattern defined to increase electron emissions and reduce work function in the film and creating at least one patterned area on said second surface having the defined pattern, wherein the defined pattern comprises a series of periodic indents, a grid, lines, hexagons, diamonds, pyramids, or circles having sharp edges and a depth of 200 nm or less and a width about 5 times a depth of said defined pattern.

The method of claim 12, further comprising wherein the defined pattern comprises a series of periodic indents resembling a square wave with mesas and troughs having a depth dimension between 5 nm and 50 nm and a length dimension between each mesa and each trough between 10 nm and 500 nm. 16. The method of claim 15, wherein the film comprises a single crystal gold film and further comprising forming the defined pattern on the second surface of the single crystal gold film.

(canceled)