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US 2020/0262199 A1Published application
Liquid discharge head and liquid discharge head manufacturing method
AssigneeCanon Kabushiki Kaisha
InventorTeruo Ozaki
Life of this patent
Estimating the term…
Abstract
A liquid discharge head that can prevent occurrence of cracks generated by a connection between an electrode pad and a wiring while reducing a manufacturing cost is provided. A bonding portion and a non-bonding portion are disposed at positions where the bonding portion and the non-bonding portion overlap an electrode and a coating film but do not overlap a through hole in a planar view of a liquid discharge head substrate.
Claims11
A liquid discharge head comprising:
- a liquid discharge head substrate including
- an element configured to discharge liquid,
- an electrode electrically connected to the element,
- an insulating coating film having a through hole and configured to cover the electrode, and
- an electrode pad configured for electrical connection with an outside and connected with the electrode via the through hole, the electrode pad being disposed on a side of the insulating coating film opposite to a side of the insulating coating film opposing the electrode;
- an electric wiring member including a wiring bonded to the electrode pad;
- a bonding portion where the electrode pad and the wiring are in contact with each other and bonded to each other;
- and
- a non-bonding portion where the electrode pad and the wiring are in contact with each other but not bonded to each other,
- wherein the bonding portion and the non-bonding portion are disposed at positions where the bonding portion and the non-bonding portion overlap the electrode and the insulating coating film but do not overlap the through hole in a planar view of the liquid discharge head substrate.
7 more elements
A liquid discharge head manufacturing method, the liquid discharge head including
- a liquid discharge head substrate including
- an element configured to discharge liquid,
- an electrode electrically connected to the element,
- an insulating coating film having a through hole and configured to cover the electrode, and
- an electrode pad configured for electrical connection with an outside and connected with the electrode via the through hole, the electrode pad being disposed on a side of the insulating coating film opposite to a side of the insulating coating film opposing the electrode, and
- an electric wiring member including a wiring bonded to the electrode pad, the method comprising:
- bringing the electrode pad and the wiring into contact with each other;
- and
- bonding the electrode pad and the wiring by pushing a part of a contact area where the electrode pad and the wiring are in contact with each other from a surface of the wiring opposite to a surface of the wiring opposing the electrode pad using a pressing unit,
- wherein in the bringing the electrode pad and the wiring into contact with each other, the liquid discharge head substrate and the electric wiring member are disposed so that the contact area overlaps the electrode and the insulating coating film but does not overlap the through hole in a planar view of the liquid discharge head substrate.
7 more elements
Dependencies are inferred from the claim text.