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US 2020/0260991 A1Published application
Pressure sensing implant
AssigneeEndotronix, Inc.
InventorsHarry Rowland, Michael Nagy, Nathan Plag, Tyler Panian, Suresh Sundaram
Life of this patent
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AssigneeEndotronix, Inc.
InventorsHarry Rowland, Michael Nagy, Nathan Plag, Tyler Panian, Suresh Sundaram
Estimating the term…
Disclosed is an implant and method of making an implant. The implant having a housing that defines a cavity. The housing includes a sensor comprising a base attached to a diaphragm wherein said base may be positioned within said cavity. The sensor may be a capacitive pressure sensor. The diaphragm may be connected to the housing to hermetically seal said housing. The sensor may include electrical contacts positioned on the diaphragm. The base may define a capacitive gap and a vent wherein the electrodes may be positioned within said capacitive gap such that at least a portion of the electrical contacts extend through the vent. The implant may include a coil in electric communication with the sensor, said coil may be positioned within said housing. A printed circuit board having at least one component may be attached to the floating base.
A wireless implant comprising:
The implant of claim 8, wherein said coil includes a coil axis wherein the coil axis is substantially perpendicular to said diaphragm.
A method of assembling an implant comprising:
A method of assembling an implant comprising:
Dependencies are inferred from the claim text.