Back to results
US 2020/0258769 A1Published application
Semiconductor manufacturing device member, method for manufacturing the same, and forming die
AssigneeNGK Insulators, Ltd.
InventorsKazuhiro NOBORI, Takuji KIMURA
Life of this patent
Estimating the term…
Abstract
A semiconductor manufacturing device member according to the present invention includes a ceramic disc with an internal electrode and a ceramic shaft that supports the disc. The disc and the shaft are integrated without having a bonding interface.
Claims12
A semiconductor manufacturing device member comprising a ceramic disc with an internal electrode and a ceramic shaft that supports the disc,
- wherein the disc and the shaft are integrated without having a bonding interface.
Dependencies are inferred from the claim text.