Laser-releasable bonding materials for 3-d ic applications
AssigneeBrewer Science Inc.
InventorsLuke Prenger, Arthur O. Southard, Qi Wu, Xiao Liu
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Abstract
Novel polyketanil-based compositions for use as a laser-releasable composition for temporary bonding and laser debonding processes are provided. The inventive compositions can be debonded using various UV lasers, at wavelengths from about 300 nm to about 360 nm, leaving behind little to no debris. The layers formed from these compositions possess good thermal stabilities and are resistant to common solvents used in semiconductor processing. The compositions can also be used as build-up layers for redistribution layer formation.
Claims31
A temporary bonding method comprising:
- providing a stack comprising:
- a first substrate having a back surface and a front surface;
- a bonding layer adjacent said front surface;
- a second substrate having a first surface;
- and
- a release layer between said first surface and said bonding layer, said release layer comprising a polyketanil;
- and
- exposing said release layer to laser energy so as to facilitate separation of said first and second substrates.
A microelectronic structure comprising:
- a first substrate having a back surface and a front surface;
- a bonding layer adjacent said front surface;
- a second substrate having a first surface;
- and
- a release layer between said first surface and said bonding layer, said release layer comprising a polyketanil.
A method of forming a release layer comprising:
- applying a composition to a substrate surface comprising glass or other transparent material, said composition comprising a polyketanil dissolved or dispersed in a solvent system;
- and
- heating said composition at a temperature of from about 60° C. to about 350° C. to form the release layer.
A method of forming a microelectronic structure, said method comprising:
- (I) forming a build-up layer on the surface of a substrate, said build-up layer comprising a polyketanil and having an upper surface that is remote from the surface of said substrate;
- (II) forming a first redistribution layer on said upper surface;
- and
- (III) optionally forming one or more additional redistribution layers on said first redistribution layer.
A microelectronic structure comprising:
- a substrate having a surface;
- a build-up layer on the substrate surface, said build-up layer comprising a polyketanil and having an upper surface that is remote from said substrate surface;
- and
- a first redistribution layer on said upper surface.
A polymer comprising recurring monomers of
- where each of R1 to R4:
- can be the same or different;
- and
- is individually selected from the group consisting of hydrogen, alkyls, alkoxys, hydroxyls, and polyethylene glycol chains.
Dependencies are inferred from the claim text.