Adhesive and method of bonding to rigid substrates
AssigneeLord Corporation
InventorsTarek AGAG, Brian CARNEY, Paul WHEELER, Andrew HEIDENREICH, Dodik KURNIAWAN, Rebecca COWLES, Douglas MOWREY
Life of this patent
Estimating the term…
Abstract
An adhesive and method for injection or compression bonding, where the adhesive is based on a grafted polypropylene resin and at least one of maleimide compound, phenolic resin, blocked isocyanate, functionalized silane, or an epoxy resin.
Claims23
A method for bonding at least two substrates in an injection or compression molding process comprising:
- a) selecting a rigid substrate;
- b) selecting a liquid introduced substrate;
- c) providing a curable adhesive comprising a grafted polypropylene and at least one other resin material;
- d) coating the rigid substrate with the curable adhesive and allowing the curable adhesive to dry;
- e) inserting the coated rigid substrate into an injection or compression molding machine;
- f) inserting the liquid introduced substrate into the compression molding machine;
- and,
- g) heating the substrates and adhesive for a period of time and at a temperature sufficient to cure the adhesive and bond the liquid introduced substrate to the rigid substrate.
A method for bonding at least two substrates in an injection or compression molding process comprising:
- a) selecting a rigid substrate;
- b) selecting a liquid introduced substrate;
- c) providing a curable adhesive comprising a grafted polyolefin and at least one other resin material;
- d) coating the rigid substrate with the curable adhesive and allowing the curable adhesive to dry;
- e) inserting the coated rigid substrate into an injection or compression molding machine;
- f) inserting the liquid introduced substrate into the compression molding machine;
- and,
- g) heating the substrates and adhesive for a period of time and at a temperature sufficient to cure the adhesive and bond the liquid introduced substrate to the rigid substrate.
A method for bonding at least two substrates in an injection or compression molding process comprising:
- a) selecting a rigid substrate;
- b) selecting a liquid introduced substrate;
- c) providing a curable adhesive comprising a benzoxazine resin and a film former;
- d) coating the rigid substrate with the curable adhesive and allowing the curable adhesive to dry;
- e) inserting the coated rigid substrate into an injection or compression molding machine;
- f) inserting the liquid introduced substrate into the compression molding machine;
- and,
- g) heating the substrates and adhesive for a period of time and at a temperature sufficient to cure the adhesive and bond the liquid introduced substrate to the rigid substrate.
An adhesive comprising a benzoxazine resin and a film former.
Dependencies are inferred from the claim text.