Composite material with adhesion promoter layer based on si, c and o
AssigneeCarl Freudenberg KG
InventorsFriederike von Fragstein, Albin Marksteiner, Roman Christopher, Stephan Rutz, Katharina Hallstein, Kai Feller, Yvonne Fetsch, Matthias Adler
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Abstract
A composite material includes: a substrate and a polymer layer which are interconnected by an adhesion promoter layer. The adhesion promoter layer is obtainable by plasma-enhanced chemical vapor deposition (PE-CVD) at least partially using a mixture of precursor compounds containing an unsaturated hydrocarbon and an organosilicon compound. In an embodiment, the substrate includes a metal substrate or a polymer substrate.
Claims20
A composite material, comprising:
- a substrate and a polymer layer which are interconnected by an adhesion promoter layer,
- wherein the adhesion promoter layer is obtainable by plasma-enhanced chemical vapor deposition (PE-CVD) at least partially using a mixture of precursor compounds containing an unsaturated hydrocarbon and an organosilicon compound.
A method for using an adhesion promotor layer, comprising:
- using the adhesion promoter layer to connect a substrate to a polymer layer,
- wherein the adhesion promoter layer is obtainable by plasma-enhanced chemical vapor deposition (PE-CVD) carried out with a mixture of precursor compounds containing at least one unsaturated hydrocarbon and at least one organosilicon compound.
Dependencies are inferred from the claim text.