Component mounting machine and component mounting method
AssigneeFuji Corporation
InventorHidetoshi KAWAI
Life of this patent
Estimating the term…
Loading patent…
AssigneeFuji Corporation
InventorHidetoshi KAWAI
Estimating the term…
A component mounting machine including: a moving device configured to move between a component supply position and a circuit board; a mounting head provided on the moving device and configured to pick up a component supplied to the component supply position and mount the picked-up component on the circuit board; a component camera configured to image the component held by the mounting head from below the mounting head; a board camera provided on the moving device and configured to image the circuit board from above; an imaging position memory section configured to memorize imaging position coordinates that are position coordinates of the moving device during imaging by the component camera, based on image data acquired by imaging of the mounting head by the component camera; a relative position memory section configured to memorize relative position coordinates that are a relative position of the mounting head with respect to the board camera; and a correction necessity determining section configured to perform imaging of the mounting head by the component camera when the moving device has arrived at the imaging position coordinates, and determine whether it is necessary to correct the relative position coordinates memorized in the relative position memory section, based on a position of the mounting head understood from image data acquired from the imaging.
A component mounting machine comprising:
A component mounting method for a component mounting machine including a moving device configured to move between a component supply position and a circuit board, a mounting head provided on the moving device and configured to pick up a component supplied to the component supply position and mount the picked-up component on the circuit board, a component camera configured to image the component held by the mounting head from below the mounting head, and a board camera provided on the moving device and configured to image the circuit board from above, the component mounting method comprising:
Dependencies are inferred from the claim text.