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US 2020/0221608 A1Published application
Heat-dissipating structure and method for manufacturing the same
AssigneeCatcher Technology Co., Ltd.
InventorsCHIA-HUNG CHANG, SHIH-WEI LEE, HAN-CHOU LIAO
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Abstract
A heat-dissipating structure includes a plurality of heat-dissipating layers and at least one heat-buffering layer. The heat-dissipating layers are stacked together. Each of the heat-dissipating layers is formed by a thermally conductive metal coated polymer fiber or thermally conductive metal fiber. The at least one heat-buffering layer is disposed between the heat-dissipating layers.
Claims20
A method for manufacturing a heat-dissipating structure, comprising:
- (A) providing a composite polymer fiber and forming the composite polymer fiber into a layered structure, wherein the composite polymer fiber has a thermally conductive metal precursor uniformly distributed thereon;
- (B) reducing the thermally conductive metal precursor to a thermally conductive metal so as to form the layered structure into a heat-dissipating layer;
- (C) providing an organic polymer fiber and forming the organic polymer fiber into a heat-buffering layer;
- and
- (D) repeating the steps (A) and (B) or the steps (A) to (C).
2 more elements
A heat-dissipating structure, comprising:
- a plurality of heat-dissipating layers stacked together, wherein each of the heat-dissipating layers is formed by a thermally conductive metal coated polymer fiber;
- and
- at least one heat-buffering layer disposed between the heat-dissipating layers.
A heat-dissipating structure, comprising:
- a plurality of heat-dissipating layers stacked together, wherein each of the heat-dissipating layers is formed by a thermally conductive metal fiber;
- and
- at least one heat-buffering layer disposed between the heat-dissipating layers.
Dependencies are inferred from the claim text.