Method of manufacturing sus integral thin film plate type heat pipe for smartphone frame

A method of manufacturing a stainless steel (SUS) integral thin film plate type heat pipe for a smartphone frame, the method comprising:

• step S100 which provides a heat pipe (100) made of SUS formed by coupling a lower plate (10) and an upper plate (20), wherein the lower plate (10) has an accommodation space (S) for a working fluid formed therein and includes a first wick (12) formed on an upper surface thereof in which the working fluid is heated at one side thereof and rises in a state of vapor, and the upper plate (20) allows the vapor to be repeatedly circulated such that the vapor is moved in a lengthwise direction thereof through a second wick (22) formed on an inner lower surface thereof, is condensed to drop to the lower plate (10), and then is moved toward a space in which a heating unit is located by the first wick (12) of the lower plate (10);
• step S300 which provides filling the working fluid in the heat pipe (100);
• step S400 which provides freezing the working fluid in the heat pipe (100);
• step S500 which provides vacuum-processing inside the heat pipe (100);
• and
• step S800 which provides performing insert injection to form an edge (60) with a preset shape and size on an outer peripheral surface of the heat pipe (100) to manufacture an integral thin film plate type heat pipe (200) for a smartphone frame.