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US 2020/0221574 A1Published application
Amethod for forming trace of circuit board
AssigneeBgt Materials Limited
InventorsKuanlin KU, Shiang-Yu CHEN, Kuo-Hsin CHANG, Chung-Ping LAI
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Abstract
The present invention provides a method for forming trace of circuit board, applicable to enhance the yield rate of circuit board and including the following step:(a) providing a plastic substrate; (b) forming an ink layer on a surface of the plastic substrate, the ink layer comprises at least one hollow pattern; (c) forming a copper plating layer in the at least one hollow pattern; and (d) removing the ink layer.
Claims18
A method for forming trace of circuit board, comprising the following step:
- (a). providing a plastic substrate;
- (b). forming an ink layer on a surface of the plastic substrate, the ink layer comprises at least one hollow pattern;
- (c). forming a copper plating layer in the at least one hollow pattern;
- and
- (d). removing the ink layer.
2 more elements
Dependencies are inferred from the claim text.