Sensing device of pressure and temperature in mold

A sensing device of pressure and temperature in a mold, a structure of the sensing device comprising:

• a housing, disposed in the mold and exposing a top surface to a mold cavity of the mold, wherein the top surface comprises a hollowly disposed channel and is in communication with an accommodating space in the housing, and a bottom surface of the housing comprises an open end in communication with the accommodating space;
• a base, disposed on the bottom surface of the housing to close the accommodating space, and comprising a mesa on a top, wherein a through hole is disposed in a center of the base;
• a strut, disposed in the accommodating space, wherein a front end of the strut is extended into the channel and exposed to the mold cavity, so that after the front end transfers pressure of the mold cavity, the strut performs an axial displacement in the channel;
• a strain structure, disposed between the mesa and the strut and configured to transform the pressure transferred by the displacement of the strut into a deformation amount of the strain structure;
• at least one strain gage, disposed on the strain structure and configured to measure the deformation amount of the strain structure and transform the deformation amount into deformation amount information;
• at least one temperature-sensing element, disposed in the strut and configured to measure a real-time temperature of the strut and transform the temperature into strut temperature information;
• and
• a processing unit, electrically connected to the strain gage and the temperature-sensing element respectively to obtain the deformation amount information and the strut temperature information.