Enhanced adhesive materials and processes for 3d applications

A method of forming a 3D integration circuit system comprising the steps of:

• forming a top wafer and a bottom wafer into a stack by;
• bonding together said top wafer and said bottom wafer by means of a polymer composite adhesive provided between said top wafer and said bottom wafer,
• said polymer composite adhesive comprising a polymer base resin, said polymer being compatible with a metal contact pad and having high thermal conductivity and a temperature stability of at least 350° C., in admixture with a plurality of carbon nanotubes (CNT), wherein, in order achieve an optimum level of bond strength and thermal conductivity, a loading level of said CNT in said polymer ranges from about 30% by volume to about 80% by volume, a length scale of said CNTs is substantially equal to a final bonded adhesive layer thickness so as to maximize said CNT's straddling an adhesive bond line with said length of said CNT to form a bonding interface;
• etching a through silicon via (TSV) from said top wafer through said bonding interface to said bottom wafer after said top wafer and said bottom wafer are bonded to connect said wafers.