Epoxy/thiol resin compositions, methods, and tapes
Assignee3M Innovative Properties Company
InventorsMatthew J. Kryger, Michael A. Kropp, Thomas B. Galush, Daniel R. Fronek
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Abstract
Curable epoxy/thiol resin compositions, methods of curing, methods of bonding substrates, and tapes including the cured polymeric material, wherein the curable epoxy/thiol resin composition includes: an epoxy resin component comprising an epoxy resin having at least two epoxide groups per molecule; a thiol component comprising a polythiol compound having at least two primary thiol groups; a silane-functionalized adhesion promoter; a nitrogen-containing catalyst for curing the epoxy resin; and optionally a cure inhibitor.
Claims23
A curable epoxy/thiol resin composition comprising:
- an epoxy resin component comprising an epoxy resin having at least two epoxide groups per molecule;
- a thiol component comprising a polythiol compound having at least two primary thiol groups;
- a silane-functionalized adhesion promoter having the following general Formula (II):
- (X)m—Y—(Si(R2)3)n
- wherein:
- X is an epoxy or thiol group,
- Y is an aliphatic group,
- m and n are independently 1-3, and
- each R2 is independently an alkoxy group;
- and
- a nitrogen-containing catalyst for curing the epoxy resin;
- wherein the epoxy resin component and/or the thiol component are selected to provide a cured polymeric material that does not crack according to the Cylindrical Mandrel Bend Test and/or has a tensile elongation of at least 100% according to the Tensile Modulus and Elongation Test.
19-31. (canceled)
A silicone tape comprising:
- a silicone backing having a major surface that is surface treated;
- a tie layer disposed on the treated major surface of the silicone backing, wherein the tie layer comprises a cured polymeric material formed from a curable epoxy/thiol resin composition comprising:
- an epoxy resin component comprising an epoxy resin having at least two epoxide groups per molecule;
- a thiol component comprising a polythiol compound having at least two primary thiol groups;
- a silane-functionalized adhesion promoter;
- a nitrogen-containing catalyst for curing the epoxy resin component;
- and
- an optional cure inhibitor;
- and
- a pressure sensitive adhesive disposed on the tie layer.
(canceled)
(canceled)
Dependencies are inferred from the claim text.