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US 2020/0148922 A1Published application
Resin composition
AssigneeNamics Corporation
InventorsFuminori ARAI, Kazuki IWAYA
Life of this patent
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Abstract
A resin composition contains one or more 2-methylene-1,3-dicarbonyl compounds. At least one of the one or more 2-methylene-1,3-dicarbonyl compounds has a molecular weight of 220 to 10,000, and the amount by weight of those of the 2-methylene-1,3-dicarbonyl compounds having a molecular weight of less than 220 relative the entire resin composition of 1 is 0.00 to 0.05. The 2-methylene-1,3-dicarbonyl compounds contain a structural unit represented by formula (I) below.
Claims24
A resin composition comprising one or more 2-methylene-1,3-dicarbonyl compounds, wherein
- at least one of the one or more 2-methylene-1,3-dicarbonyl compounds has a molecular weight of 220 to 10,000;
- the amount by weight of those of the 2-methylene-1,3-dicarbonyl compounds having a molecular weight of less than 220 relative to the entire resin composition of 1 is 0.00 to 0.05;
- and
- the 2-methylene-1,3-dicarbonyl compounds comprise a structural unit represented by formula (I) below.
1 more element
Dependencies are inferred from the claim text.