Seal for microelectronic assembly
AssigneeInvensas Bonding Technologies, Inc.
InventorsRajesh Katkar, Liang Wang, Cyprian Emeka Uzoh, Shaowu Huang, Guilian Gao, Ilyas Mohammed
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Abstract
Representative implementations of techniques and devices provide seals for sealing the joints of bonded microelectronic devices as well as bonded and sealed microelectronic assemblies. Seals are disposed at joined surfaces of stacked dies and wafers to seal the joined surfaces. The seals may be disposed at an exterior periphery of the bonded microelectronic devices or disposed within the periphery using the various techniques.
Claims21
(canceled)
A method of forming a microelectronic assembly, the method comprising:
- bonding a first bonding surface of a first microelectronic component to a second bonding surface of a second microelectronic component along a bond joint;
- after the bonding, forming a channel from an outside surface of the first microelectronic component to at least the bond joint, the outside surface opposite the first bonding surface;
- and
- forming a seal in the channel that extends from the outside surface to at least the bond joint.
A microelectronic assembly comprising:
- a first microelectronic component having a first bonding surface;
- a second microelectronic component having a second bonding surface, the first and second bonding surfaces bonded along a bond joint;
- a channel extending from an outside surface of the first microelectronic component to at least the bond joint, the outside surface opposite the first bonding surface;
- and
- a seal disposed in the channel and that extends from the outside surface to at least the bond joint.
Dependencies are inferred from the claim text.