Back to results
US 2020/0140263 A1Published application
Reduced mems cavity gap
AssigneeInvenSense, Inc.
InventorsIan FLADER, Dongyang KANG
Life of this patent
Estimating the term…
Abstract
Provided herein is a method including forming a MEMS cap. A cavity is formed in the MEMS cap wafer, and a bond material is deposited on the MEMS cap wafer, wherein the bond material lines the cavity after the depositing. The MEMS cap wafer is bonded to a MEMS device wafer, wherein the bond material forms a bond between the MEMS cap wafer and the MEMS device wafer. A MEMS device is formed in the MEMS device wafer. The bond material is removed from the cavity.
Claims14
A method comprising:
- forming a micro-electro-mechanical system (“MEMS”) cap wafer;
- forming a cavity in the MEMS cap wafer;
- depositing a bond material on the MEMS cap wafer, wherein the bond material lines the cavity after the depositing;
- bonding the MEMS cap wafer to a MEMS device wafer, wherein the bond material forms a bond between the MEMS cap wafer and the MEMS device wafer;
- forming a MEMS device in the MEMS device wafer;
- and
- removing the bond material from the cavity.
4 more elements
An apparatus comprising:
- a cap cavity in a micro-electro-mechanical system (“MEMS”) cap wafer, the cap cavity overlying a MEMS device;
- a MEMS wafer including the MEMS cap wafer and a MEMS device wafer, the MEMS device wafer including the MEMS device;
- and
- a bond connecting the MEMS cap wafer to the MEMS device wafer, wherein
- the bond includes a material, and
- the material has been removed from portions of the cavity.
3 more elements
Dependencies are inferred from the claim text.