Semiconductor device package and method of manufacturing the same
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorsChing-Han HUANG, Hsun-Wei CHAN, Yu-Hsuan TSAI
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Abstract
A semiconductor device package includes a carrier; a sensor element disposed on or within the carrier; a cover disposed above the carrier and comprising a top surface, a bottom surface and an inner sidewall, the inner sidewall defining a penetrating hole extending from the top surface to the bottom surface; and a light transmissive element covering the penetrating hole, wherein the sensor element senses or detects light passing through the light transmissive element.
Claims20
A semiconductor device package, comprising:
- a carrier;
- a sensor element disposed on or within the carrier;
- and
- a cover comprising a top surface, a bottom surface and an inner sidewall,
- wherein the inner sidewall defines a penetrating hole extending from the top surface to the bottom surface, the penetrating hole exposes the sensor element, the inner sidewall comprises a titled inner sidewall, and
- wherein the inner sidewall is a light reflection surface.
A semiconductor device package, comprising:
- a carrier;
- a sensor element disposed on or within the carrier;
- and
- a cover comprising a top surface, a bottom surface, and an inner sidewall,
- wherein the inner sidewall defines a penetrating hole extending from the top surface to the bottom surface, the penetrating hole exposes the sensor element, and a dimension of the penetrating hole at the bottom surface is larger than a dimension of the penetrating hole at the top surface, and
- wherein the inner sidewall is a light reflection surface.
A semiconductor device package, comprising:
- a carrier;
- a sensor element for receiving light disposed on or within the carrier;
- and
- a cover comprising a top surface, a bottom surface, and an inner sidewall,
- wherein the inner sidewall defines a penetrating hole extending from the top surface to the bottom surface, the penetrating hole exposes the sensor element, the inner sidewall comprises a titled inner sidewall, and
- wherein the inner sidewall is configure to direct undesired parasitic light away from the sensor element.
Dependencies are inferred from the claim text.