Bonding pad layer system, gas sensor and method for manufacturing a gas sensor

A method for manufacturing a gas sensor including a bonding pad layer system and a paste dot, comprising the following steps in the order:

• a) providing a micromechanical semiconductor chip as a base, in which at least one self-supporting dielectric membrane made up of dielectric layers and a platinum conductor track for electrically contacting a heater made of platinum is integrated;
• b) depositing a tantalum layer;
• c) depositing a first platinum layer;
• d) depositing a tantalum nitride layer;
• e) depositing a second platinum layer;
• f) depositing a gold layer;
• g) providing at least one bonding pad for connecting to a bonding wire on the gold layer in an area of a contact hole on the semiconductor chip, in which a platinum conductor track leading to the heater is connected using a ring contact, and providing at least one bonding pad outside a contact hole, which is used to electrically contact electrode structures and conductor tracks;
• h) providing the electrode structures and the conductor tracks;
• i) providing a paste dot;
• and
• j) sintering the paste dot.