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US 2020/0139705 A1Published application
Encapsulating a Bonded Wire with Low Profile Encapsulation
AssigneeHewlett-Packard Development Company, L.P.
InventorsChien-Hua Chen, Michael W. Cumbie, Zhuqing Zhang
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Abstract
Encapsulating a bonded wire with low profile encapsulation includes applying encapsulation over a bonded wire that is connected to a die on a first end and to a circuit component on a second end and truncating a shape of the encapsulation to form a truncated shape.
Claims15
A method for encapsulating a bonded wire with low profile encapsulation, comprising:
- applying an encapsulation material over a bonded wire, the bonded wire being connected to a die on a first end, and the bonded wire being connected to a circuit component on a second end;
- and
- compressing the encapsulation material, using a stamp, from a deposited shape to a truncated shape.
A method for encapsulating a bonded wire with low profile encapsulation, comprising:
- applying an encapsulation material over a bonded wire, the bonded wire being connected to a die on a first end, and the bonded wire being connected to a circuit component on a second end;
- heating a stamp to compress the encapsulation material from a deposited shape to a truncated shape;
- and
- compressing the encapsulation material, using the heated stamp, from the deposited shape to the truncated shape, wherein the truncated shape reflects a geometry of an underside of the stamp.
1 more element
A method for encapsulating a bonded wire with low profile encapsulation, comprising:
- applying an encapsulation material over a bonded wire, the bonded wire being connected to a die on a first end, and the bonded wire being connected to a circuit component on a second end;
- and
- shaping, using the guide, and while applying the encapsulation material over the bonded wire, the encapsulation material into a truncated shape having a truncated height,
- wherein the truncated shape reflects a geometry of an underside of the guide, and
- wherein the truncated height is less than a hundred microns in height.
2 more elements
Dependencies are inferred from the claim text.