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US 2020/0139490 A1Published application
Solder Preform for Diffusion Soldering, Method for the Production thereof, and Method for the Assembly Thereof
AssigneeSiemens Aktiengesellschaft
InventorsJörg Strogies, Klaus Wilke, Christian Schellenberg
Life of this patent
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Abstract
Various embodiments include a solder preform for diffusion soldering comprising a sandwich structure having a multiplicity of first layers and a multiplicity of second layers alternating with one another in the sandwich structure. The first layers each comprise a metal foil. The second layers each comprise metal particles and a binder forming a paste.
Claims9
A solder preform for diffusion soldering, the preform comprising:
- a sandwich structure having a multiplicity of first layers and a multiplicity of second layers alternating with one another in the sandwich structure;
- wherein the first layers each comprise a metal foil;
- and
- the second layers each comprise metal particles and a binder forming a paste.
1 more element
A method for producing a solder preform, the method comprising:
- stacking a multiplicity of first layers with a multiplicity of second layers to form a sandwich structure;
- wherein the first layers and the second layers alternate with one another in the sandwich structure;
- wherein each of the first layers comprises a metal foil;
- and
- each of the second layers comprises metal particles and a binder form a paste.
2 more elements
A method for making a diffusion soldering connection, the method comprising:
- placing a solder preform between a first connection partner and a second connection partner;
- and
- melting the solder preform to form the diffusion soldering connection;
- wherein the solder preform comprises:
- a sandwich structure having a multiplicity of first layers and a multiplicity of second layers alternating with one another in the sandwich structure;
- wherein the first layers each comprise a metal foil;
- and
- the second layers each comprise metal particles and a binder forming a paste.
5 more elements
Dependencies are inferred from the claim text.