Wafer producing apparatus

A wafer producing apparatus that produces a wafer from an ingot, the wafer producing apparatus comprising:

• an ingot grinding unit including a first holding table that holds the ingot and grinding means that grinds an upper surface of the ingot held by the first holding table to planarize the upper surface;
• a laser irradiation unit including a second holding table that holds the ingot and laser irradiation means that positions a focal point of a laser beam with such a wavelength as to be transmitted through the ingot to a depth corresponding to a thickness of a wafer to be produced from the upper surface of the ingot held by the second holding table and irradiates the ingot with the laser beam to form a separation layer;
• a wafer separating unit including a third holding table that holds the ingot and wafer separating means that holds the upper surface of the ingot held by the third holding table and separates a wafer from the separation layer;
• a tray including an ingot support part that supports the ingot and a wafer support part that supports the separated wafer;
• a belt conveyor unit that conveys the ingot supported by the tray among the ingot grinding unit, the laser irradiation unit, and the wafer separating unit;
• an ingot stocker in which the ingot supported by the tray is housed;
• and
• an ingot delivery unit that delivers the ingot supported by the tray housed in the ingot stocker to the belt conveyor unit.