Electroplating composition and electroplating method

An electroplating composition comprising:

• a first leveling agent and a second leveling agent,
• wherein the first leveling agent and the second leveling agent each, independently, comprise a compound represented by Chemical Formula 1 below:
• In Chemical Formula 1,
• X, Y, Z and W are each, independently, selected from the group consisting of hydrogen (—H), an alkyl group (—R), an amino group (—NH2), a thiol group (—SH), and a hydroxyl group (—OH);
• or
• X and W are each, independently, selected from the group consisting of hydrogen, an alkyl group, an amino group, a thiol group, and a hydroxyl group, and Y and Z are each, independently, selected from the group consisting of H, C, O, N, S, Se, and Si as atoms included in the same heterocyclic ring;
• or
• Z and W are each, independently, selected from the group consisting of hydrogen, an alkyl group, an amino group, a thiol group, and a hydroxyl group, and X and Y are each, independently, selected from the group consisting of H, C, O, N, S, Se, and Si as atoms included in the same heterocyclic ring.