Interchangeable guide head for transfer mechanism
AssigneeRohinni, LLC
InventorAndrew Huska
Life of this patent
Estimating the term…
Abstract
An apparatus including a dot matrix transfer head that includes an impact wire housing. A plurality of impact wires are disposed within the impact wire housing and extend out of the impact wire housing. A splaying element attached to a bottom surface of the impact wire housing. The plurality of impact wires extend into and through the splaying element. A guide head attached to a bottom surface of the splaying element. The guide head includes multiple holes that arrange the plurality of impact wires in a matrix configuration. The splaying element is designed to direct the plurality of impact wires toward the multiple holes in the guide head.
Claims20
A transfer mechanism, comprising:
- an impact wire housing;
- a plurality of impact wires secured within the impact wire housing at a first end of the plurality of impact wires;
- and
- a guide head having a base side and an attachment side that opposes the base side, the guide head being removably attached to the impact wire housing via the attachment side, the guide head including a plurality of holes that extend from the attachment side through the base side, each of the holes being sized to accommodate insertion of a single impact wire of the plurality of impact wires,
- wherein the guide head is configured to removably attach to the impact wire housing in a direction that is coincident with a direction of extension of the plurality of impact wires after the plurality of impact wires are secured within the impact wire housing.
A dot matrix transfer head, comprising:
- an impact wire housing;
- a plurality of impact wires disposed within the impact wire housing and extending out of the impact wire housing;
- a splaying element attached to a bottom surface of the impact wire housing, wherein the plurality of impact wires extend into and through the splaying element;
- and
- a guide head attached to a bottom surface of the splaying element, the guide head including multiple holes configured to arrange the plurality of impact wires in a matrix configuration,
- wherein the splaying element is configured to direct the plurality of impact wires towards the multiple holes in the guide head.
An apparatus for executing a direct transfer of one or more semiconductor device die from a wafer tape to a substrate, the apparatus comprising:
- an impact wire housing configured to house multiple impact wires, wherein the multiple impact wires are secured within the impact wire housing at a first end of the multiple impact wires;
- an actuator communicatively coupled to a controller configured to actuate the multiple impact wires;
- a splaying element disposed adjacent the impact wire housing, wherein the multiple impact wires extend out of the impact wire housing and through the splaying element, the splaying element configured to spread the multiple impact wires away from each other;
- and
- a guide having a plurality of holes removably attached to the splaying element in direction coincidental with a direction of extension of the multiple impact wires, wherein the multiple impact wires extend at least partially into the plurality of holes.
Dependencies are inferred from the claim text.