# US 2020/0098549 A1 · Heat conductive spacer for plasma processing chamber > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2020/0098549 A1 - Document ID: US20200098549A1 - Status: Published application - Kind: A1 - Application number: 16/143,280 - Filed: 2018-09-26 - Published: 2020-03-26 - Earliest claimed: 2018-09-26 - Applicants: Applied Materials, Inc. - Inventors: Beom Soo PARK; Robin L. TINER; Jianheng LI; Sang Jeong OH; Lai ZHAO; Gaku FURUTA; Soo Young CHOI; Jeevan Prakash SEQUEIRA; Wei-Ting CHEN; Hsiao-Ling YANG; Cheng-Hang HSU; Won Ho SUNG; Hyun Young HONG - Web page: https://patentgrep.com/patent/US20200098549A1 ## CPC - H01J 37/32522: {Temperature} - C23C 16/4405: {Cleaning of reactor or parts inside the reactor by using reactive gases} - C23C 16/45565: {Shower nozzles} - C23C 16/45572: {Cooled nozzles} - C23C 16/505: using radio frequency discharges - C23C 16/5096: {Flat-bed apparatus} - H01J 37/3244: {Gas supply means} - H01J 37/32862: {In situ cleaning of vessels and/or internal parts} - H01J 2237/002: Cooling arrangements - H01J 2237/3321: CVD [Chemical Vapor Deposition] - H01J 2237/3323: uniformity - H01J 2237/3325: large area - H01J: ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS (spark-gaps H01T; electric arc lamps H05B31/00; particle accelerators H05H) - C23C: COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL (making metal-coated products by extrusion B21C23/22; covering with metal by connecting pre-existing layers to articles, see the relevant places, e.g. B21D39/00, B23K; metallising of glass C03C; metallising mortars, concrete, artificial stone, ceramics or natural stone C04B41/00; enamelling of, or applying a vitreous layer to, metals C23D; treating metal surfaces or coating of metals by electrolysis or electrophoresis C25D; single-crystal film growth C30B; by metallising textiles D06M11/83; decorating textiles by locally metallising D06Q1/04) ## Abstract A plasma processing chamber includes a chamber body and a lid assembly coupled to the chamber body to define a processing volume. The lid assembly includes a backing plate coupled to the chamber body, a diffuser with a plurality of openings formed therethrough, and a heat conductive spacer disposed between and coupled to the backing plate and the diffuser to transfer heat from the diffuser to the backing plate. The plasma processing chamber further includes a substrate support disposed within the processing volume. ## Claims ### Claim 1 A plasma processing chamber, comprising: a chamber body; a lid assembly coupled to the chamber body defining a processing volume, the lid assembly comprising: a backing plate coupled to the chamber body; a diffuser comprising a plurality of openings formed therethrough; and a heat conductive spacer disposed between and coupled to the backing plate and the diffuser to transfer heat from the diffuser to the backing plate; and a substrate support disposed within the processing volume. ### Claim 2 (depends on 1) The plasma processing chamber of claim 1, wherein the heat conductive spacer is in direct contact with a top surface of the diffuser and a bottom surface of the backing plate. ### Claim 3 (depends on 2) The plasma processing chamber of claim 2, wherein: the heat conductive spacer comprises a rectangular cross-section; and a width of the heat conductive spacer is equal to or larger than a thickness of the diffuser. ### Claim 4 (depends on 1) The plasma processing chamber of claim 1, wherein the heat conductive spacer comprises aluminum. ### Claim 5 (depends on 1) The plasma processing chamber of claim 1, further comprising a plurality of fasteners extending through the heat conductive spacer to couple the heat conductive spacer between the backing plate and the diffuser. ### Claim 6 (depends on 5) The plasma processing chamber of claim 5, wherein the backing plate, the diffuser, and the fasteners each comprise aluminum. ### Claim 7 (depends on 1) The plasma processing chamber of claim 1, wherein the heat conductive spacer is disposed about a periphery of the diffuser and defines a plenum between the backing plate and the diffuser. ### Claim 8 (depends on 7) The plasma processing chamber of claim 7, wherein the heat conductive spacer comprises a pair of long sides and a pair of short sides. ### Claim 9 (depends on 1) The plasma processing chamber of claim 1, wherein the backing plate comprises a cooling flow channel formed therein to receive coolant. ### Claim 10 (depends on 9) The plasma processing chamber of claim 9, wherein the heat conductive spacer is in vertical alignment with at least a portion of the cooling flow channel. ### Claim 11 (depends on 1) The plasma processing chamber of claim 1, further comprising an RF power source coupled to the lid assembly. ### Claim 12 (depends on 1) The plasma processing chamber of claim 1, further comprising a gas source and a remote plasma source in fluid communication with the processing volume through the lid assembly. ### Claim 13 A lid assembly for a plasma processing chamber, comprising: a backing plate; a diffuser comprising a plurality of openings formed therethrough; and a heat conductive spacer disposed between and coupled to the backing plate and the diffuser to transfer heat from the diffuser to the backing plate. ### Claim 14 (depends on 13) The lid assembly of claim 13, further comprising a lid plate with the backing plate coupled to the lid plate. ### Claim 15 (depends on 13) The lid assembly of claim 13, wherein the backing plate, the diffuser, and the heat conductive spacer each comprise aluminum. ### Claim 16 (depends on 13) The lid assembly of claim 13, wherein: the heat conductive spacer is in direct contact with a top surface of the diffuser and a bottom surface of the backing plate; the heat conductive spacer comprises a rectangular cross-section; and a width of the heat conductive spacer is equal to or larger than a thickness of the diffuser. ### Claim 17 (depends on 13) The lid assembly of claim 13, wherein: the heat conductive spacer is disposed about a periphery of the diffuser and defines a plenum between the backing plate and the diffuser; and the heat conductive spacer comprises a pair of long sides and a pair of short sides. ### Claim 18 (depends on 13) The lid assembly of claim 13, wherein: the backing plate comprises a cooling flow channel formed therein to receive coolant; and the heat conductive spacer is in vertical alignment with at least a portion of the cooling flow channel. ### Claim 19 A lid assembly for a plasma processing chamber, comprising: a backing plate; a diffuser comprising a plurality of openings formed therethrough and a cooling flow channel formed therein to receive coolant; and a heat conductive spacer comprising a rectangular cross-section that is disposed between and in direct contact with a bottom surface of the backing plate and a top surface of the diffuser to transfer heat from the diffuser to the backing plate. ### Claim 20 (depends on 19) The lid assembly of claim 19, wherein the backing plate, the diffuser, and the heat conductive spacer each comprise aluminum.