Systems and methods to secure flame spread restriction of individual sub-modules in an ultrasonic gas leak detector

An apparatus comprising:

• a barrier structure disposed between a first sub-module and a second sub-module, wherein the barrier structure is configured to restrict flame spread between the first sub-module and the second sub-module, and wherein the barrier structure comprises:
• a first housing part comprising a first cavity structure;
• a second housing part comprising a second cavity structure;
• a printed circuit board comprising a first surface and a second surface opposite the first surface, wherein the printed circuit board is disposed in a third cavity structure formed by the first cavity structure and the second cavity structure;
• a first electrical connector disposed on the first surface of the printed circuit board and configured to provide a first electrical connection to the first sub-module;
• and
• a second electrical connector disposed on the second surface of the printed circuit board and configured to provide a second electrical connection to the second sub-module,
• wherein the first electrical connector is electrically connected to the second electrical connector through the printed circuit board.

A method for manufacturing an apparatus for detecting a gas leak, the method comprising:

• providing a first housing part of a barrier structure;
• mounting a printed circuit board to the first housing part, wherein the printed circuit board comprises a first surface and a second surface opposite the first surface, wherein the printed circuit board comprises a first electrical connector disposed on the first surface of the printed circuit board and configured to provide a first electrical connection to a sensor sub-module, and wherein the printed circuit board comprises a second electrical connector disposed on the second surface of the printed circuit board and configured to provide a second electrical connection to a processor sub-module;
• mounting a second housing part of the barrier structure to the first housing part, wherein the printed circuit board is disposed in a cavity structure positioned between the first housing part and the second housing part;
• and
• filling the cavity structure with an encapsulation material.