New three dimensional structured packing for improving the contact between a gas phase and a dispersed solid phase following in counter-current

A packing that makes it possible to achieve homogeneous contact between a gas phase and an emulsion phase flowing in counter-current, said packing being characterized by a three-dimensional structure, consisting in reproducing an elementary pattern produced by means of 3 secant planes, said elementary three-dimensional pattern being a complex volume delimited by 3 vanes, each vane belonging to a plane, and the 3 planes thus defined being such that, considered in pairs, they always have an intersection, each vane being situated in one of the secant planes, and the various elementary patterns being distributed in a plane that is distinct from the 3 secant planes with a triangular pitch spacing, this plane being referred to as a distribution layer, and the final structure corresponding to a vertical stack of several parallel distribution layers, each of these layers having the same density of elementary patterns, in which packing said elementary patterns are inscribed inside a triangular-pitch mesh, the pitch spacing being from 1 to 1.5 times the minimum distance d defined by d=(a+a*cos(60°)+b/2 sin(90°−α)), the angle α being the angle that the vanes of the pattern make with the horizontal, and which is comprised between 45° and 75°, and preferably between 55° and 65°,

• a being the width of the vanes and comprised between 3 cm and 30 cm, and preferably between 5 cm and 15 cm, and b being the distance separating two successive layers and comprised between 3 cm and 50 cm, and preferably between 6 cm and 20 cm, and the successive layers being such that, from one layer to the next, the triangle formed by the 3 most closely-spaced elementary patterns belonging to the layer (N) is offset in layer (N+1) so that the vertex of a triangle of the layer (N+1) lies at the center of the circle inscribed inside the triangle of the layer (N).