Electronic component module and manufacturing method thereof
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorChul Hwan JUNG
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Abstract
An electronic device module includes a first substrate, at least one electronic device mounted on a lower surface of the first substrate, a second substrate mounted on a lower surface of the first substrate to electrically connect the first substrate to an external source of power, a connecting conductor bonded to a lower surface of the second substrate, and a sealing portion sealing the electronic device, the second substrate, and the connecting conductor, wherein a mounting height of the second substrate is configured to be lower than a mounting height of the electronic device.
Claims16
An electronic device module, comprising:
- a first substrate;
- at least one electronic device mounted on a lower surface of the first substrate;
- a second substrate mounted on the lower surface of the first substrate, the second substrate configured to electrically connect the first substrate to an external source of power;
- a connecting conductor bonded to a lower surface of the second substrate;
- and
- a sealing portion that seals the at least one electronic device, the second substrate, and the connecting conductor,
- wherein a mounting height of the second substrate is configured to be lower than a mounting height of the electronic device.
A method for manufacturing an electronic device module, the method comprising:
- disposing at least one electronic device on a lower surface of a first substrate;
- forming a second substrate on the lower surface of the first substrate;
- sealing at least one electronic device and the second substrate in a sealing portion;
- and
- exposing a portion of the at least one electronic device by removing a portion of the sealing portion and a portion of the electronic device.
Dependencies are inferred from the claim text.