Liquid immersion cooling platform
AssigneeTMGCore, LLC
InventorsJohn David Enright, Jake Mertel
Life of this patent
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Abstract
A two-phase liquid immersion cooling system is described in which heat generating computer components cause a dielectric fluid in its liquid phase to vaporize. The dielectric vapor is then condensed back into a liquid phase and used to cool the computer components. Using a pressure controlled vessel and pressure controller, the disclosed system may be operated at less than ambient pressure. By controlling the pressure at which the system operates, the user may influence the temperature at which the dielectric fluid vaporizes and thereby achieve increased performance from a given computer component. Utilizing robotic arms and slot-in computing components, a self-healing computing system may be created.
Claims21
A cooling system for computing components comprising:
- a pressure controlled vessel comprising an interior and an exterior wherein said vessel comprises a top, a bottom, a front, a back and opposing sides and is configured to be operated above 650 torr, wherein the pressure controlled vessel is configured to comprise a volume of thermally conductive, condensable dielectric fluid in liquid and gas phase wherein the dielectric fluid has a boiling point below about 80 C at atmospheric pressure and wherein the dielectric fluid is substantially free of water;
- one or more computer components arranged such that the one or more computer components may be at least partially submerged within the liquid phase of a volume of thermally conductive, condensable dielectric fluid;
- a condenser on at least one of the opposing sides for actively condensing gas phase dielectric fluid to liquid phase dielectric fluid wherein the pressure controlled vessel is configured to direct gas phase of the thermally conductive dielectric fluid toward the condenser on at least one of the opposing sides;
- and wherein the top of said vessel comprises a condenser-free removable lid.
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A method for cooling computer components, the method comprising:
- providing a thermally conductive, condensable dielectric fluid in a liquid and gas phase in a pressure controlled vessel comprising a top, a bottom, a front, a back and opposing sides and comprising an active condenser located on an opposing side of the pressure controlled vessel;
- and
- operating computer components at a pressure above 650 torr in the presence of the thermally conductive, condensable dielectric fluid_wherein the dielectric fluid is substantially free of water, wherein the computer components are at least partially in contact with the thermally conductive, condensable dielectric fluid in liquid phase and wherein the dielectric fluid condenses in the active condenser located on the opposing side of the pressure controlled vessel and wherein the top of said vessel comprises a condenser-free removable lid.
The method of cooling computer components, the method comprising:
- operating computer components at above 650 torr in a pressure controlled vessel comprising a top, a bottom, a front, a back and opposing sides and an active condenser located on an opposing side of the pressure controlled vessel, wherein the computer components are at least partially in contact with a thermally conductive, dielectric fluid, and wherein the boiling point of the dielectric fluid is below about 80° C. at atmospheric pressure and wherein the dielectric fluid is substantially free of water and wherein the top of said vessel comprises a condenser-free removable lid.
Dependencies are inferred from the claim text.