Substrate placement mechanism, film forming apparatus, and film forming method

A substrate placement device that places thereon a substrate on which film formation is performed in a film forming apparatus, the substrate placement device comprising:

• a stage having a substrate placement surface on which the substrate is placed;
• a cooling head provided to face a side of the stage opposite to the substrate placement surface, and configured to be cooled to an extremely low temperature by a refrigerator;
• a contact/separation plate configured to cause the stage and the cooling head to be brought into contact with or separated from each other;
• a rotator configured to rotate the stage;
• and
• a controller,
• wherein the controller is configured to:
• cause, except during the film formation, the substrate to be placed on the stage in a state where the stage and the cooling head are brought into contact with each other by the contact/separation plate;
• and cause, during the film formation, the stage to be rotated by the rotator in a state where the stage and the cooling head are separated from each other by the contact/separation plate.