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US 2020/0093008 A1Published application
Contact structures with porous networks for solder connections, and methods of fabricating same
AssigneeInvensas Corporation
InventorsLiang Wang, Rajesh Katkar, Hong Shen, Cyprian Emeka Uzoh
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Abstract
A contact pad includes a solder-wettable porous network (310) which wicks the molten solder (130) and thus restricts the lateral spread of the solder, thus preventing solder bridging between adjacent contact pads.
Claims20
An assembly comprising:
- a first contact pad of a first microelectronic component, the first contact pad comprising a porous network;
- and
- a second contact pad of a second microelectronic device, the second contact pad bonded to the first contact pad via a solder at least partly disposed in pores of the porous network.
A contact pad resistant to solder-bridges between adjacent contact pads, for making a microelectronic component with contact pads at fine pitch, comprising:
- a gold alloy at a bonding interface of the microelectronic component;
- and
- a wicking layer of the gold alloy comprising a porous network, the wicking layer comprising pores with diameters between 15-360 nm to absorb a solder at least 15 nm into the contact pad via capillary action.
A die for microelectronics, comprising:
- a substrate;
- a contact pad on the substrate;
- a layer of the contact pad etched into a porous sponge;
- and
- pores of the porous sponge comprising a diameter between 15-360 nm.
2 more elements
Dependencies are inferred from the claim text.